Muhannad S. Bakir received the B.E.E. degree from Auburn University, Auburn, AL, in 1999 and the M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology (Georgia Tech) in 2000 and 2003, respectively.
Dr. Bakir is currently the Dan Fielder Professor in the School of Electrical and Computer Engineering and the director of 3D Systems Packaging Research Center. He is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. In 2015, Dr. Bakir was elected by the IEEE CPMT Society to serve as a distinguished lecturer for a four-year term. Dr. Bakir and his research group have received more than 25 conference and student paper awards including six from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), and one from the IEEE Custom Integrated Circuits Conference (CICC). Dr. Bakir’s group was awarded the 2014 Best Paper of the IEEE Transactions on Components Packaging and Manufacturing Technology in the area of advanced packaging. Dr. Bakir is an editor of a book entitled Integrated Interconnect Technologies for 3D Nanoelectronic Systems (with James D. Meindl) and is the author/coauthor of more than 180 journal publications and conference proceedings, 12 US patents, and the presenter of multiple international conference tutorials, including an invited tutorial on 3D IC and interconnect technologies at the International Solid-State Circuits Conference (ISSCC).
Dr. Bakir is an editor of IEEE Transactions on Electron Devices and an associate editor of IEEE Transactions on Components, Packaging and Manufacturing Technology.
- Ph.D., Electrical and Computer Engineering, Georgia Institute of Technology, 2003
- M.S., Electrical and Computer Engineering, Georgia Institute of Technology, 2000
- B.E.E., Electrical Engineering, Auburn University, 1999
Bakir’s research centers on the design, fabrication, and characterization of semiconductor advanced packaging, heterogeneous integration technologies, microscale cooling technologies, and co-packaged optics. His work explores novel materials and fabrication processes along with system architectures to advance the performance and integration of next-generation electronic systems. This includes investigating the electrical properties and reliability of emerging semiconductor advanced package technologies, bridging fundamental science and engineering applications. Graduate and undergraduate student involvement is integral to his research program.
Bakir’s teaching interests encompass foundational and advanced topics in electrical and computer engineering. His focus includes microelectronic advanced packaging and integrated circuit fabrication technologies, aiming to provide students with a rigorous understanding of microsystem design and manufacturing. He is committed to fostering hands-on learning and critical thinking skills among undergraduate and graduate students through theoretical and practical coursework.
- 2013 Intel Early Career Faculty Honor Award
- 2012 DARPA Young Faculty Award
- 2012 National Academy of Engineering Frontiers of Engineering Symposium Invited Participant
- 2011 IEEE CPMT Outstanding Young Engineer Award
- Semiconductor Research Corporation (SRC) Inventor Recognition Awards (2002, 2005, 2009)
- Associate Director of the Georgia Tech Interconnect and Packaging Center (IPC), an SRC Center of Excellence
- Best Invited Paper Award from the 2007 IEEE Custom Integrated Circuits Conference (CICC)
- Best Paper Award from the 2002 Electronic Components and Technology Conference (ECTC)
- Outstanding Paper Award from the 2007 Electronic Components and Technology Conference (ECTC)
- Co-recipient of the Best Student Paper Awards from the 2005, 2006, 2008 IEEE International Interconnect Technology Conference (IITC)
- Co-recipient of the Motorola Electronic Packaging Student Paper Award from the 2008 Electronic Components and Technology Conference (ECTC)
- Co-recipient of the SRC TECHCON 2009 Best in Session Paper Award
- Co-recipient of the Best Student Paper Award from the 2009 International Symposium on Microelectronics
- Twelve issued US Patents
- Member of the International Technology Roadmap for Semiconductors (ITRS)
- Associate Editor for IEEE Transactions on Electronics Packaging Manufacturing
- Pradyot Yadav, Danish A. Baig, Jinchen Wang, Ulrich L. Rohde, Muhannad S. Bakir et al., 3-D-Millimeter Wave Integrated Circuits (3D-mmWIC) Using GaN-on-Si Dielets With Si CMOS for 5G FR2 Power Amplifiers, IEEE Transactions on Microwave Theory and Techniques, 2026 DOI: 10.1109/tmtt.2026.3653256
- Zhonghao Zhang, Paul K. Jo, Shane Oh, Muhannad S. Bakir, Direct Die-to-Die Bridging for Heterogeneous mm-Wave Circuits Enabled by Fused-Silica Stitch-Chip Technology, IEEE Transactions on Components Packaging and Manufacturing Technology, 2025 DOI: 10.1109/tcpmt.2025.3587609
- Euichul Chung, Muhannad S. Bakir, Integrated Microfluidic Cooling of Heterogeneous HBM–GPU Package With Die Height Difference, IEEE Transactions on Components Packaging and Manufacturing Technology, 2025 DOI: 10.1109/tcpmt.2025.3605312
- R. Krishna et al., "Temperature-Dependent SPICE Models for UCIe Interconnects," 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, 2025, pp. 1-3, doi: 10.1109/EPEPS63858.2025.11346572
- A. Victor, M. Manley and M. S. Bakir, "SiO2-Based Chiplet Reconstitution Technology for Multi-Height Chiplet Integration," 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, USA, 2025, pp. 531-536, doi: 10.1109/ECTC51687.2025.00094