Photo file: 
Full name: 
Madhavan Swaminathan
Job title: 
Professor
; Director, Center for Co-Design of Chip, Package, System (C3PS) ; John Pippin Chair in Electromagnetics
Technical Interest Groups: Electromagnetics
Email address: 
Work phone: 
404/894-3340
Fax: 
404.894.9959
Office: 
Klaus 1358

Madhavan Swaminathan is the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech. He formerly held the position of Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the NSF Microsystems Packaging Research Center, Georgia Tech. Prior to joining Georgia Tech, he was with IBM working on packaging for supercomputers. He is the author of 450+ refereed technical publications, holds 29 patents, primary author and co-editor of 3 books (Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2007; Introduction to System on Package, McGraw Hill, 2008; and Design and Modeling for 3D ICs and Interposers, WSP, 2013), founder and co-founder of two start-up companies (E-System Design and Jacket Micro Devices), and the founder of an international IEEE conference (Electrical Design of Advanced Packaging and Systems - EDAPS). His research has been recognized through several awards, including 19 best paper and best student paper awards, 2014 Distinguished Alumnus Award from NITT (India), 2014 Outstanding Sustained Technical Contribution Award from IEEE CPMT Society, 2007 Technical Excellence Award from Semiconductor Research Corporation, 2003 Georgia Tech Outstanding Faculty Leadership Award for the Advisement of GRAs, 2002 Outstanding Graduate Research Advisor Award from Georgia Tech ECE, and IBM Outstanding Faculty Award in 2004 and 2005. He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE EMC society. He received his BE Degree in Electronics and Communication from Regional Engineering College, Tiruchirapalli (now NITT) in 1985 and MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.

Research interests: 
  • Numerical methods in electromagnetics
  • Mixed signal design
  • Signal, power, and thermal integrity
  • Power delivery
  • IC-Package Co-design
Distinctions: 
  • IEEE Fellow
  • Distinguished Lecturer, IEEE EMC Society
  • 2015 ECE Outreach Award
  • 2014 Outstanding Sustained Technical Contribution Award, IEEE CPMT Society
  • 2014 Distinguished Alumnus Award, NITT (India)
  • 2007 Technical Excellence Award, Semiconductor Research Corporation
  • 2003 Georgia Tech Outstanding Faculty Leadership Award for the Advisement of GRAs
  • 2002 Georgia Tech ECE Outstanding Graduate Research Advisor Award

N. Na, J. Choi, S. Chun, M. Swaminathan and J. Srinivasan, "Modeling and Transient Simulation of Planes in Electronic Packages", To appear in IEEE Transactions on Components, Packaging and Manufacturing Tech-nology - Advanced Packaging, Aug 2000.

K. L. Choi and M. Swaminathan, "Development of Model Libraries for Embedded Passives Using Net-work Synthesis", IEEE Transactions on Circuits and Systems - II, pp. 1-12, April 2000

S. Pannalla, J. Bandhyopadyay and M. Swaminathan, "Contribution of Resonance to Ground Bounce in Lossy Thin Film Planes", IEEE Transactions on Components, Packaging and Manufacturing Tech-nology - Advanced Packaging, Vol. 22, No. 3, pp. 249-258, Aug. 1999.

Sreemala Pannalla and Madhavan Swaminathan, "Extraction of S-Parameters from TDR/TDT Mea-surements using Rational Functions", IEEE 54th Automatic RF Techniques Group (ARFTG) Confer-ence Digest, pp. 45-52, Atlanta, Dec. 1999.

Madhavan Swaminathan: "Challenges in the Design of Next Generation of Mixed Signal Packages," invited seminar, Second International Symposium on Emerging Microelectronics and Interconnection Technology, Bangalore, India, 1998.

Kwang Choi, Nanju Na and Madhavan Swaminathan, "Characterization of Embedded Passives Using Macromodels in LTCC Technology", IEEE Transactions on Components, Packaging and Manufacturing Technology - Advanced Packaging, Vol. 21, No. 3, pp. 258-268, Aug. 1998.

Mark G. Allen, P. Chahal, M. Swaminathan, R.R. Tummala: "A Novel Integrated Decoupling Capacitor for MCM-L Technology," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, vol. 21, no. 2, pp. 184-193, 1998.

A. Chatterjee, J. Hughes, Madhavan Swaminathan, H. Yoon: "Catastrophic Fault Diagnosis for Embedded MCM RF-Passives Using Single Point Probing," IMAPS Advanced Technology Workshop on MCM Test IV, 1997.

Madhavan Swaminathan: "VPSA-A Novel Packaging Technology," invited seminar, The Panda Project, San Jose, CA, 1997.

Madhavan Swaminathan: "Electronic Technological Trends Causing a Revolution in Connector Design, invited seminar, Fleck Connector Congress, Palm Springs, CA, 1997.

K. Choi, Madhavan Swaminathan: "Utilization of Fast Algorithms to Analyze Embedded Passive Components Using Commercial EM Solvers," Proceedings of the 6th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 27-29, 1997.

Abhijit Chatterjee, J.L.A. Hughes, M. Swaminathan, H. Yoon: "Catastrophic Fault Diagnosis for Embedded RF Passives Using Single Point Probing," IMAPS Advanced Technology Workshop on MCM Test IV, 1997.

J. Bandhyopadyay, P. Chahal, Madhavan Swaminathan: "Importance of Damping and Resonance in Thin Film Integrated Decoupling Capacitor Design," Proceedings of the 6th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 31-34, 1997.

A. Chatterjee, B. Kim, Madhavan Swaminathan: "A Survey of Test Techniques for MCM Substrates," chapter in Multi-chip Module Test Strategies, edited by Y. Zorian, ISBN 0-7923-9920-X, Kluwer Academic Publishers, 1997.

W. Russell Callen, Jr., B. Kim, M. Swaminathan: "Electrical Interconnect Test Technique for MCMs," First International Conference on Emerging Microelectronics and Interconnection Technologies, pp. 285-290, Bangalore, India, February 1996 (with B. Kim and M. Swaminathan). "Relay Propagation Scheme for Testing of MCMs on Large Area Substrates," Proceedings of the European Test Conference, pp. 285-290, 1996.

M. Allen, P. Chahal, Madhavan Swaminathan, R. Tummala: "A Novel Integrated Decoupling Capacitor for MCM-L Technology," 46th Electronics Technology and Components Conference Proceedings, pp. 125-132, 1996.

W. Russell Callen, Jr., B. Kim, M. Swaminathan: "Low Cost Diagnosis of Defects in MCM Substrate Interconnections," Proceedings of the VLSI Test Symposium, pp. 260-265, 1996.

A. Chatterjee, B. Kim, Madhavan Swaminathan: "High Resolution and Low-Cost Test Technique for Unpopulated MCM Substrate," 46th Electronics Technology and Components Conference Proceedings, pp. 225-233, 1996.

Mark G. Allen, P. Chahal, M. Swaminathan, R. Tummala: "A Novel Integrated Decoupling Capacitor for MCM-L Technology," Proceedings of the 1996 Electronic Components Technology Conference, 1996.

W. Russell Callen, Jr., B. Kim, M. Swaminathan: "High Resolution and Low Cost Test Technique for Unpopulated MCM Substrates," 46th Electronics Components and Technology Conference, pp. 226-233, 1996.

M.G. Allen, P. Chahal, M. Swaminathan, Rao R. Tummala: "A Novel Integrated Decoupling Capacitor for MCM-L Technology," presented at the 46th Electronic Components and Technology Conference, Orlando, FL, 1996.

A. Chatterjee, B. Kim, Madhavan Swaminathan: "Electrical Interconnect Test Technique for MCM," International Conference on Emerging Microelectronics and Interconnection Technologies Proceedings, Bangalore, India, pp. 285-290, 1996.

K. Bathey, A. Haridass, Madhavan Swaminathan, R. Tummala: "Noise: A Measure of Performance Comparison for Single Chip Packages," International Conference on Emerging Microelectronics and Interconnection Technologies Proceedings, pp. 207-212, 1996.

W. Russell Callen, Jr., F. Crnic, B. Kim, S. Koppolu, M. Swaminathan: "Electrical Test of MCMs," chapter in Microelectronics Packaging Handbook, edited by R. Tummala and E. Rymaszewski, Van Nostrand Reinhold, 1996, 1996.

K. Bathey, Madhavan Swaminathan: "Noise Computation in Single Chip Packages," IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B: Advanced Packaging, vol. 19, no. 2, pp. 350-360, 1996.

E.D. Perfecto, C. Prasad, K. Prasad, G.J. Robbins, Madhavan Swaminathan, G.E. White: "Minimal Capture Pads Applied to Ceramic Vias in Ceramic Substrates," Patent Number 5,464,682, 1995.

A. Chatterjee, B. Kim, D. Schimmel, Madhavan Swaminathan: "A Novel Low-Cost Approach to MCM Interconnect Test," International Test Conference, Washington, DC, 1995.

Madhavan Swaminathan: "Improving Wireability on Non-Planar Structures for the Next MCM-D Generation," International Journal of Microcircuits and Electronic Packaging, v 18 4, pp. 375-381, 1995.

A. Chatterjee, B. Kim, Madhavan Swaminathan: "A New Technique for Testing MCM Substrates," 2nd Advanced Technology Workshop on MCM Test, 1995.

W. Russell Callen, Jr., B. Kim, M. Swaminathan: "A Novel MCM Interconnect Test Technique Based on Resonator Principles and Transmission Line Theory," IEEE Fourth Topical Meeting on Electrical Performance of Electrical Packaging, pp. 117-119, 1995.

A. Chatterjee, B. Kim, Madhavan Swaminathan: "A Novel MCM Interconnect Test Technique Based on Resonator Principles and Transmission Line Theory," 4th Topical Meeting on Electrical Performance of Electronic Packaging Proceedings, pp. 117-119, 1995.

J. Hao, Joy Laskar, J. Mosley, A. Richter, M. Swaminathan: "Plastic Package Characterization for RF and Wireless Applications," Wireless Technology Conference, Stamford, CT, 1995.

W. Russell Callen, Jr., B. Kim, M. Swaminathan: "A Novel Low-Cost Approach to MCM Interconnect Test," Proceedings of the International Test Conference, pp. 184-192, 1995.

J. Hao, J. Laskar, J. Mosley, A. Richter, Madhavan Swaminathan: "Frequency Domain Measurements of VSPA: A Novel Packaging Technology," 4th Topical Meeting on Electrical Performance of Electronic Packaging Proceedings, Portland, OR, pp. 113-136, 1995.

J. Hao, Joy Laskar, J. Mosley, A. Richter, M. Swaminathan: "Frequency Domain Measurements of VSPA: A Novel Packaging Technology," Electronic Performance of Electronic Packaging Conference, pp. 133-136, 1995.

K. Bathey, Madhavan Swaminathan: "Resonance Analysis and Simulation in Packages," 4th Topical Meeting on Electrical Performance of Electronic Packaging Proceedings, pp. 169-172, 1995.

A. Chatterjee, B.C. Kim, David E. Schimmel, M. Swaminathan: "A Novel Low-Cost Approach to MCM Interconnect Test," Proceedings of the International Test Conference, 1995.

Last revised July 11, 2016