Photo file: 
Full name: 
David C Keezer
Job title: 
Professor
Technical Interest Groups: Microelectronics/Microsystems, VLSI Systems and Digital Design
Email address: 
Work phone: 
404/894-4741
Fax: 
404.894.9959
Office: 
Klaus 1360

Professor Keezer was born in Detroit, Michigan and grew up in Michigan, Maryland, New York, and California. He attended the University of California, Berkeley where he completed his BA in Physics and Applied Mathematics in 1978.

He began his graduate studies at Caltech where he earned his MS degree in Applied Physics in l979 and continued work towards the Ph.D. In 1980 he moved to Carnegie-Mellon University where he completed the Ph.D. in 1983. His studies focused on domain wall dynamics in magnetic bubble memory devices.

Between 1983 and 1989 he worked at Harris Corporation in Melbourne, Florida where he developed and applied electrical test methods to Very Large Scale Integrated Circuits. He earned an M.B.A. in 1985 from the Florida Institute of Technology. In 1989 he began work at the University of South Florida as an Associate Professor of Electrical Engineering.

Dr. Keezer joined the Georgia Tech faculty in l995 and continues to teach classes in Electrical and Computer Engineering and conduct research on the design and test of high performance logic systems. His hobbies include playing the trumpet and numerous sports activities.

Research interests: 
  • Test methods for high performance electronic systems
  • Design of high speed logic systems
  • Advanced electronics packaging methods
  • Computer applications for music
Distinctions: 
  • Member, IEEE
  • Member, American Physical Society
  • Intl. Test Conference Program committee member

"A Parallel Test Method for MCM Substrate Interconnection Networks" K.E. Newman, D.C. Keezer, J.S. Davis, Intl. Journal of Microcircuits and Electronic Packaging, Vol. 21, No.2, pp.197-204, Aug. 1998.

David C. Keezer, Q. Zhou: "Application of the HP83000 for Testing a 2.5 Gbps Pattern Generator Module," Proceedings of the HP Semiconductor Test Users Group Conference, 1998.

"Using Voltage-Contrast and Critical-Path Tracing for Fault Isolation in Sequential Logic Networks" D.C. Keezer, SCANNING (The Journal of Scanning Microscopy), Vol. 20, No. 3, pp. 162-163, April 1998.

David C. Keezer, R.J. Wenzel: "A New Low-cost Method for MCM Substrate Test," IMAPS/IEEE Advanced Technology Workshop on MCM Test, vol. 4, pp. 55-59, 1997.

"Transmission Line Transient Analysis in Lossy Dispersive MCM Technologies" R.J. Wenzel, D.C. Keezer, Intl. Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 2, pp. 187-195, June, 1997.

David C. Keezer, R.J. Wenzel: "Low-cost ATE Pin Electronics for Multigigabit-per-second At-speed Test," Proceedings of the International Test Conference, pp. 94-100, 1997.

"Low Cost ATE Pin Electronics for Multigigabit-per-second At-speed Test" D.C. Keezer, R.J. Wenzel, Proc. of the Intl. Test Conference (ITC'97), pp. 94-100, Washington, D.C., November, 1997.

David C. Keezer, K.E. Newman: "A Low-cost Massively-parallel Interconnect Test Method," Proceedings of the International Test Conference, pp. 370-378, 1997.

"A Low-cost Massively-parallel Interconnect Test Method" K.E. Newman, D.C. Keezer, Proc. of the Intl. Test Conference (ITC'97), pp. 370-378, Washington, D.C., November, 1997.

David C. Keezer: "Yield, Testing, and Reliability," chapter 11 in Handbook of Thin Film Technology, (A. Elshabini-Riad, ed.), pp. 11-1, January, 1997.

"Yield, Testing, and Reliability" D.C. Keezer, Chapter 11 in Handbook of Thin Film Technology , (A.Elshabini-Riad Editor), pp. 11-1 through 11-50, McGraw-Hill, Inc., December 1997.

David C. Keezer, R.J. Wenzel: "Performance Characteristics of Low-cost Multigigahertz MCM Test Electronics," IMAPS/IEEE Advanced Technology Workshop on MCM Test, vol. 4, pp. 25-30, 1997.

S.N. Busansky, David C. Keezer, S.A. Little: "Technology Reinvestment Experiences under the RAMP Program," Government Microelectronics Applications Conference, vol. 21, pp. 83-84, 1996.

David C. Keezer, R.J. Wenzel: "The Effects of Dielectric Material Properties on Broadband Signal Propagation in Multichip Module Transmission Lines," Proceedings of the Second International Symposium on Advanced Packaging Materials, p. 74, Atlanta, GA, p. 74, 1996.

David C. Keezer: "Material and Structural Defects in TAB Interconnects," invited presentation at the Second International Symposium on Advanced Packaging Materials, Atlanta, GA, 1996.

David C. Keezer, J. Rates: "Energy Dispersive X-Ray Spectroscopy Characterization of Tape-Automated Bond Metallurgical Interfaces to Silicon Micro-circuits," SCANNING - The Journal of Scanning Microscopy, vol. 18, no. 3, pp. 218-219, 1996.

David C. Keezer, R.J. Wenzel: "Architecture and Pin Electronics for a Multi-Gigahertz Digital Test System," Government Microelectronics Applications Conference, vol. 21, pp. vol.-82, 1996.

David C. Keezer: "Automated Fault Isolation for MCMs," Proceedings of the IEEE/ISHM Advanced Technology Workshop on MCM Test, pp. 50-51, 1995.

"Fault Isolation and Performance Characterization of High Speed Digital Multichip Modules" D.C. Keezer, IEEE Trans. on Components, Packaging, and Manufacturing Technology (CPMT-B), Vol. 18, No. 4, pp. 614-619, November, 1995.

David C. Keezer: "Electrical Troubleshooting, Diagnostics, and Repair of Multichip Modules," Proceedings of the International Test Conference, p. 917, Washington, DC, p. 917, 1995.

David C. Keezer: "Integrating MCM Guided Probe Software with an Electron Beam Prober," Proceedings of the International HP82/83000 Users Group Meeting, pp. 41-46, 1995.

David C. Keezer, A.S. Slater-Haase: "Structural and Materials Characterization of Tape Automated Bond Electrical Interconnections," Proceedings of the ASM Materials Week Conference, Cincinnati, OH, 1995.

David C. Keezer: Proceedings of the 1995 International HP82000/83000 Users Group Meeting, GigaTest, Inc., Rockville, MD, 1995.

David C. Keezer: "Fault Isolation and Performance Characterization of High Speed Digital MCMs," IEEE Transactions on Components, Packaging, and Manufacturing Technology (CPMT-B), vol. 18, no. 4, pp. 614-619, 1995.

David C. Keezer, J. Rates: "Investigation of Quality and Failure Mechanisms in TAB Contacts," Proceedings of the IEEE/ISHM Advanced Technology Workshop on MCM Test, pp. 52-53, 1995.

Last revised May 16, 2016