ECE Course Outline

ECE4755

Electronic Packaging Substrate Fabrication (1-6-3)

Prerequisites
(CHEM 1310 or CHEM 1211K or CHEM 12X1) and PHYS 2212
Corequisites
None
Catalog Description
This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. Crosslisted with CHE 4755.
Textbook(s)
Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, 2002. ISBN 0071371699, ISBN 9780071371698 (required)

Topical Outline
1.	Introduction to Packaging (including PRC SLIM)
2.	Lab Safety
3.	Interconnect Design
4.	Polymer Deposition
5.	Via Formation
6.	Metallization
7.	Substrate Testing