ECE Course Outline

ECE4754

Electronics Packaging Assembly, Reliability, Thermal Management, and Test (2-3-3)

Prerequisites
ECE 3030 [min C] or ECE 3040 [min C] or ECE 3710
Corequisites
None
Catalog Description
The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems. Crosslisted with ME and MSE 4754.
Textbook(s)
Tummala, Fundamentals of Microsystem Packaging, McGraw Hill, 2002. ISBN 9780071371698 (required)

Topical Outline
1. Introduction to Next Generation Packaging
2. Thermo-Mechanical Modeling and Reliability
3. Assembly Processes and Materials
4. Functional Testing
5. Thermal Management
6. Reliability Testing