ECE Course Outline
Electronics Packaging Assembly, Reliability, Thermal Management, and Test (2-3-3)
- ECE 3030 [min C] or ECE 3040 [min C] or ECE 3710
- Catalog Description
- The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems. Crosslisted with ME and MSE 4754.
- Tummala, Fundamentals of Microsystem Packaging, McGraw Hill, 2002. ISBN 9780071371698 (required)
- Topical Outline
1. Introduction to Next Generation Packaging 2. Thermo-Mechanical Modeling and Reliability 3. Assembly Processes and Materials 4. Functional Testing 5. Thermal Management 6. Reliability Testing