ECE Course Outline

ECE4460

Introduction to Electronic Systems Packaging (3-0-3)

Prerequisites
ECE 3030 [min C] or ECE 3040 [min C] or ECE 3710
Corequisites
None
Catalog Description
Introduction to packaging technologies, technology drivers, electrical performance, thermal management, materials, optoelectronics, RF integration, reliability, system issues, assembly, and testing.
Textbook(s)
Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, 2001. ISBN 9780071371698 (required)

Topical Outline
Introduction
. Packaged Electronics
. Technologies
. Trends
Technology Drivers
. Wireability
. Electrical Issues
. Thermal Considerations
. Reliability
. Testability
Electrical Design
. Interconnect Capacitance, Resistance and Inductance fundamentals
. Transmission Lines (basic concepts)
. Clock Distribution
. Noise Sources
. Power Distribution
. Digital and RF Issues
Thermal Management
. Heat-transfer fundamentals
. Thermal conductivity and resistance
. Conduction, convection and radiation
. Cooling
Reliability
. Basic concepts
. Environmental interactions
. Thermal mismatch and fatigue
Testing
. Need for testing
. Substrate Testing (Capacitance and Resistance)
. Functional Testing (Boundary Scan)