ECE Course Syllabus

ECE4460 Course Syllabus


Introduction to Electronic Systems Packaging (3-0-3)

ECE 3030 [min C] or ECE 3040 [min C] or ECE 3710


Catalog Description
Introduction to packaging technologies, technology drivers, electrical performance, thermal management, materials, optoelectronics, RF integration, reliability, system issues, assembly, and testing.

Swaminathan & Engin, Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2007. ISBN 0136152066 (required)

Bakoglu, Circuits, Interconnections and Packaging of VLSI, Addison Wessley.(optional)

Tummala, Fundamentals of Microsystems Packaging, 2001.(optional)

Swaminathan and Han, Design and Modeling for 3D ICs and Interposters, World Scientific Publishing Company, 2013. ISBN 9789814508599(optional)

Oh & Yuan, High Speed Signaling: Jitter Modeling, Analysis and Budgeting, Prentice Hall, 2012.(optional)

Topical Outline
. Packaged Electronics
. Technologies
. Trends
Technology Drivers
. Wireability
. Electrical Issues
. Thermal Considerations
. Reliability
. Testability
Electrical Design
. Interconnect Capacitance, Resistance and Inductance fundamentals
. Transmission Lines (basic concepts)
. Clock Distribution
. Noise Sources
. Power Distribution
. Digital and RF Issues
Thermal Management
. Heat-transfer fundamentals
. Thermal conductivity and resistance
. Conduction, convection and radiation
. Cooling
. Basic concepts
. Environmental interactions
. Thermal mismatch and fatigue
. Need for testing
. Substrate Testing (Capacitance and Resistance)
. Functional Testing (Boundary Scan)