ECE Course Outline

ECE3450

Semiconductor Devices (3-0-3)

Prerequisites
ECE 3040 [min C]
Corequisites
None
Catalog Description
Properties of semiconductor devices. Applications in current and future computers, fiber optic and wireless communication systems. Future needs of high frequency, GHz-range, device operation.
Textbook(s)
Anderson & Anderson, Fundamentals of Semiconductor Devices, McGraw-Hill, 2005. ISBN 0072369779, ISBN 9780072369779 (required)

Topical Outline
1.	System Application Background                                          
   a.	Current and future computer systems
   b.	Current and future fiber optic and wireless communication systems

2.	General Limits/Capabilities of Existing Technologies
   a.	Silicon device characterisgtics

3.	Review of Semiconductor Device Basics
   a.	Band structure
   b.	Doping and impurities
   c.	Device physics for p-n junctions

4.	Specific Devices for Computers, Wireless and Fiber:
   a.	Mixers (AC characteristics of p-n junctions, junction and diffusion capitance, nonlinear issues)
   b.	FETs - Silicon MOSEFT's (MOS Capacitor, threshold voltage, capacitance effects, self-aligned gates, short-chanel effects, basics of CMOS logic families, etc.)

5.	BJTs
   a.	Basic-device operation
   b.	High-speed Silicon BJTs (DC characteristics)
   c.	GaAs-based HBTs (DC characteristics, RF characteristics)

6.	Sources (emitters)
   a.	LEDs, (e.g., color, electron-hole annihiliation, generation/recombination)
   b.	Semiconductor Lasers (Fabry Perot structure, cleavage planes and mirror surfaces, AR & HT coatings, simple models for laser operation, DFB and DBR lasers)   

7.	Detectors
   a.	Photodiodes (optical absorption, minority carrier injection, factors affecting speed)
   b.	Avalanche photodiodes (carrier multiplication, noise, superlattice structures, speed)     
                                           
8.	Fabrication Issues:
   a.	Integrated Circuit Fabrication
      i.	Fabrication of monolithic circuits
      ii.	The computation-interconnection balance
      iii.	Testing and packaging
      iv.	Yield and fabrication economics
   b.	VLSI Scaling
      i.	Self-consistency
      ii.	Ideal and practical scaling
      iii.	Fundamental and practical limits to scaling
      iv.	The influence of parasitics and interconnect