Thermal Engineering for Packaging of Micro and Nano SystemsPassive, active, and hybrid thermal management techniques, and computational modeling of micro systems. Air cooling, simlge phase and phase change liquid cooling, heat pipes, and thermoelectrics. Crosslisted with ME 6779.
Theory of Electronic DevicesPresents the fundamentals of electronic device operation
Microelectronic CircuitsBasic concepts of microelectronic materials, devices and circuits.
Plasma Processing of Electronic Materials and DevicesFundamental physics, chemistry, chemical engineering and electrical
engineering principles inherent in plasma processes. Includes etching,
deposition, diagnostic methods, and control schemes. Cross-listed with
Silicon-Based Heterostructure Devices and CircuitsTheory and design of novel silicon-germanium microelectronic devices and circuits. Materials, device physics, fabrication, measurement, circuit design, and system applications.
Semiconductor Devices for Wireless & Fiber CommunicationAdvanced development of semiconductor device theory focusing on
optoelectronic emitters, detectors, & high frequency transistors to
provide an understanding of devices used in communications systems
Measurements, Circuits and Microelectronics LaboratoryBasic electronic test instrumentation. Elementary passive and active circuits using both discrete (diodes, bipolar junction transistors, MOSFETs) and integrated devices (operational amplifiers).
Semiconductor Process ControlThis course is designed to explore methods of applying statistical process
control and statistical quality control to semiconductor manufacturing
processes. Students will be required to complete a design project.
Introduction to Microelectronics TechnologyPresents the fundamentals of microelectronics material, device, and circuit
Semiconductor DevicesProperties of semiconductor devices. Applications in current and future computers, fiber optic and wireless communication systems. Future needs of high frequency, GHz-range, device operation.
Introduction to Electronic Systems PackagingIntroduction to packaging technologies, technology drivers, electrical
performance, thermal management, materials, optoelectronics, RF
integration, reliability, system issues, assembly, and testing.
Electronic Packaging Substrate FabricationThis course provides hands-on instruction in basic packaging substrate
fabrication techniques, including interconnect design and testing,
dielectric deposition, via formation, and metallization. Crosslisted with
Integrated and Low-Cost Microelectronics Systems PackagingBroad overview of system-level, cross-disciplinary microelectronics
packaging technologies, including design, test, thermal, reliability,
optoelectronics, and RF integration. Comparison of system-on-chip and
system-on-package. Crosslisted with ME and MSE 6776.
Solar CellsTo provide a practical understanding of semiconductor materials and
technology as it relates to design and development of efficient solar
cells and photovoltaic systems.
Optoelectronics: Devices, Integration, Packaging, SystemsOptoelectronic devices (detectors, emitters, modulators) from the
practical realized and theoretical performance perspective. Explores
monolithic and hybrid integration of devices, packaging and system
Optoelectronics: Materials, Processes, DevicesOptoelectronic materials, physical processes, and devices. Includes
compound semiconductor materials, excitation, recombination, gain, and
modulation processes and devices such as emitters, detectors, and
modulators. Crosslisted with PHYS 6771.
Integrated Circuit FabricationIntroduction to microelectronic processing technologies and CMOS. Includes a laboratory for fabrication/testing of MOS transistors, basic CMOS circuits, integrated resistors and capacitors.
Microelectromechanical DevicesFundamental concepts for design of microelectromechanical devices (MEMS), including mechanical and thermal behavior of materials and structures, transduction principles, transducer design, and modeling.
Introduction to MEMSIntroduction to Micro-Electro-Mechanical systems: Microfabrication techniques including: photolithography, etching, physical and chemical vapor deposition, electroplating, bonding and polymer processing. Application to sensors and actuators. Credit not allowed for both ECE 6229 and ME 6229 or CHBE 6229.
Introduction to the Theory of MicroelectronicsBasis of quantum mechanics, statistical mechanics, and the behavior of
solids to serve as an introduction to the modern study of semiconductors
and semiconductor devices.
Gigascale IntegrationHierarchy of physical principles that enable understanding and
estimation of future opportunities to achieve multibillion transistor
silicon chips using sub-0.25 micron technology.
Integrated Circuit FabricationThe objective of this course is to give students exposure to the various
steps involved in the fabrication of integrated circuits and devices.
'The course will include a laboratory segment in which students
fabricate MOS transistors, diffused resistors and MOS capacitors from a
bare silicon substrate. Crosslisted with CHE 4752.
Electronics Packaging Assembly, Reliability, Thermal Management, and TestThe course provides hands-on instruction in electronics packaging,
including assembly, reliability, thermal management, and test of
next-generation microsystems. Crosslisted with ME and MSE 4754.