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ECE Courses by TIG

Course NumberCourse Title and Catalog Description


Microelectromechanical Devices

Fundamental concepts for design of microelectromechanical devices (MEMS), including mechanical and thermal behavior of materials and structures, transduction principles, transducer design, and modeling.


Plasma Processing of Electronic Materials and Devices

Fundamental physics, chemistry, chemical engineering and electrical engineering principles inherent in plasma processes. Includes etching, deposition, diagnostic methods, and control schemes. Cross-listed with CHE 6759.


Introduction to Microelectronics Technology

Presents the fundamentals of microelectronics material, device, and circuit fabrication


Semiconductor Devices

Properties of semiconductor devices. Applications in current and future computers, fiber optic and wireless communication systems. Future needs of high frequency, GHz-range, device operation.


Silicon-Based Heterostructure Devices and Circuits

Theory and design of novel silicon-germanium microelectronic devices and circuits. Materials, device physics, fabrication, measurement, circuit design, and system applications.


Thermal Engineering for Packaging of Micro and Nano Systems

Passive, active, and hybrid thermal management techniques, and computational modeling of micro systems. Air cooling, simlge phase and phase change liquid cooling, heat pipes, and thermoelectrics. Crosslisted with ME 6779.


Semiconductor Process Control

This course is designed to explore methods of applying statistical process control and statistical quality control to semiconductor manufacturing processes. Students will be required to complete a design project.


Microelectronic Circuits

Basic concepts of microelectronic materials, devices and circuits.


Introduction to MEMS

Introduction to Micro-Electro-Mechanical systems: Microfabrication techniques including: photolithography, etching, physical and chemical vapor deposition, electroplating, bonding and polymer processing. Application to sensors and actuators. Credit not allowed for both ECE 6229 and ME 6229 or CHBE 6229.


Introduction to the Theory of Microelectronics

Basis of quantum mechanics, statistical mechanics, and the behavior of solids to serve as an introduction to the modern study of semiconductors and semiconductor devices.


Gigascale Integration

Hierarchy of physical principles that enable understanding and estimation of future opportunities to achieve multibillion transistor silicon chips using sub-0.25 micron technology.


Solar Cells

To provide a practical understanding of semiconductor materials and technology as it relates to design and development of efficient solar cells and photovoltaic systems.


Optoelectronics: Devices, Integration, Packaging, Systems

Optoelectronic devices (detectors, emitters, modulators) from the practical realized and theoretical performance perspective. Explores monolithic and hybrid integration of devices, packaging and system implementation.


Electronic Packaging Substrate Fabrication

Hands-on instruction in interconnect design, substrate material selection and properties, photodielectric deposition, via formation and photolithography, copper metallization, and substrate testing. Crosslisted with CHE 4755.


Integrated and Low-Cost Microelectronics Systems Packaging

Introduction to cross-disciplinary microelectronic packaging technologies, including electrical design, thermal considerations and technologies, reliability, optoelectronic packaging, and RF-/mm-wave packaging. Crosslisted with ME and MSE 6776.


Measurements, Circuits and Microelectronics Laboratory

Theory and experiments related to the design, analysis, construction, and measurement of elementary passive and active analog circuits using both discrete and integrated devices.


Semiconductor Devices for Wireless & Fiber Communication

Advanced development of semiconductor device theory focusing on optoelectronic emitters, detectors, & high frequency transistors to provide an understanding of devices used in communications systems


Introduction to Electronic Systems Packaging

Introduction to packaging technologies, technology drivers, electrical performance, thermal management, materials, optoelectronics, RF integration, reliability, system issues, assembly, and testing.


Theory of Electronic Devices

Presents the fundamentals of electronic device operation


Integrated Circuit Fabrication

The objective of this course is to give students exposure to the various steps involved in the fabrication of integrated circuits and devices. 'The course will include a laboratory segment in which students fabricate MOS transistors, diffused resistors and MOS capacitors from a bare silicon substrate. Crosslisted with CHE 4752.


Optoelectronics: Materials, Processes, Devices

Optoelectronic materials, physical processes, and devices. Includes compound semiconductor materials, excitation, recombination, gain, and modulation processes and devices such as emitters, detectors, and modulators. Crosslisted with PHYS 6771.


Electronics Packaging Assembly, Reliability, Thermal Management, and Test

The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems. Crosslisted with ME and MSE 4754.


Integrated Circuit Fabrication

Introduction to microelectronic processing technologies and CMOS. Includes a laboratory for fabrication/testing of MOS transistors, basic CMOS circuits, integrated resistors and capacitors.