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ECE Patents
Process Compensated Micromechanical Resonators
Gavin K. Ho, Farrokh AyaziJuly 21, 20097,564,162Systems and Methods for Cascode Switching Power Amplifiers
Joy Laskar, Ockgoo Lee, Jeonghu Han, Hyugwook Kim, Dong Ho Lee, Ki Seok Yang, Chang-Ho Lee, Haksun KimJuly 14, 20097,560,994Lead-Free Bonding Systems
Rao R. Tummala, Ankur Aggarwal, Isaac R. Abothu, Pulugurtha Markondeya RajJuly 7, 20097,556,189Lead-Free Bonding Systems
Rao R. Tummala, Ankur Aggarwal, Isaac R. Abothu, Pulugurtha Markondeya RajJuly 7, 20097,556,189High-Aspect-Ratio Metal-Polymer Composite Structures for Nano Interconnects
Rao R. Tummala, Ankur Aggarwal, Pulugurtha Markondeya RajJuly 7, 20097,557,448High-Aspect-Ratio Metal-Polymer Composite Structures for Nano Interconnects
Rao R. Tummala, Ankur Aggarwal, Pulugurtha Markondeya RajJuly 7, 20097,557,448Production Test Technique for RF Circuits Using Embedded Test Sensors
Donghoon Han, Abhijit ChatterjeeJune 30, 20097,554,335High Input/Output Density Optoelectronic Probe Card for Wafer-Level Test of Electrical and Optical Interconnect Components, Methods of Fabrication and Methods of Use
Muhannad S. Bakir, Tony Mule, Hiren Thacker, James D. Meindl, Thomas K. Gaylord, Kevin P. Martin, Paul A. KohlJune 30, 20097,554,347High Input/Output Density Optoelectronic Probe Card for Wafer-Level Test of Electrical and Optical Interconnect Components, Methods of Fabrication and Methods of Use
Muhannad S. Bakir, Tony Mule, Hiren Thacker, James D. Meindl, Thomas K. Gaylord, Kevin P. Martin, Paul A. KohlJune 30, 20097,554,347High Input/Output Density Optoelectronic Probe Card for Wafer-Level Test of Electrical and Optical Interconnect Components, Methods of Fabrication and Methods of Use
Muhannad S. Bakir, Tony Mule, Hiren Thacker, James D. Meindl, Thomas K. Gaylord, Kevin P. Martin, Paul A. KohlJune 30, 20097,554,347
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