ECE Patents

  • Lead-Free Bonding Systems

    Rao R. Tummala, Ankur Aggarwal, Isaac R. Abothu, Pulugurtha Markondeya Raj
    July 7, 2009
  • High-Aspect-Ratio Metal-Polymer Composite Structures for Nano Interconnects

    Rao R. Tummala, Ankur Aggarwal, Pulugurtha Markondeya Raj
    July 7, 2009
  • Production Test Technique for RF Circuits Using Embedded Test Sensors

    Donghoon Han, Abhijit Chatterjee
    June 30, 2009
  • High Input/Output Density Optoelectronic Probe Card for Wafer-Level Test of Electrical and Optical Interconnect Components, Methods of Fabrication and Methods of Use

    Muhannad S. Bakir, Tony Mule, Hiren Thacker, James D. Meindl, Thomas K. Gaylord, Kevin P. Martin, Paul A. Kohl
    June 30, 2009
  • Integrated Passive Devices Fabricated Utilizing Multi-Layer Organic Laminates (A)

    Sidharth Dalmia, Venkatesh Sundaram, George White, Madhavan Swaminathan
    June 24, 2009
  • Capacitive Bulk Acoustic Wave Gyroscopes

    Farrokh Ayazi, Houri Johari
    June 9, 2009
  • Blind Selected Mapping Techniques for Crest Factor Reduction of Forward Link CDMA Signals

    Ning Chen, Guotong Zhou
    May 19, 2009
  • Systems, Methods, and Apparatuses for a Long Delay Generation Technique for Spectrum-Sensing of Cognitive Radios

    Jongmin Park, Taejoong Song, Kyutae Lim, Chang-Ho Lee, Jeongsuk Lee, Kihong Kim, Seongsoo Lee, Haksun Kim, Joy Laskar
    May 5, 2009
  • Highly-Sensitive Displacement-Measuring Optical Device

    Neal A. Hall, F. Levent Degertekin, Wook Lee
    April 14, 2009
  • Lens-Less Spectrometer

    Chao Ray Hsieh, Ali Adibi, Arash Karbaschi, Omid Momtahan
    April 7, 2009