Hanju Oh received the first place poster award at the IEEE Global Interposer Technology Conference, held November 5-7 at the Georgia Tech Global Learning Center. A Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE), Oh is advised by ECE Associate Professor Muhannad Bakir and ECE Professor and College of Engineering Dean Gary May.
The title of the award-winning poster was “Electrical Interconnect and Microfluidic Cooling within 3D ICs and Silicon Interposer.” Oh’s coauthors on the work were Li Zheng and Yue Zhang, his fellow Ph.D. students in the Integrated 3D Systems Group, which is led by Bakir.
The poster presented a three-dimensional integrated circuit (3D IC) system with an embedded microfluidic cooling heat sink (MFHS). In the proposed 3D IC system, high power tiers contain embedded MFHS and high-aspect ratio (23:1) through-silicon vias (TSVs) routed through the integrated MFHS. Each tier has dedicated solder-based electrical and fluidic microbumps for electrical interconnection and fluidic delivery, respectively. In addition, thermal characterization of a microfluidic heat sink with embedded TSVs was also presented for the first time.
Last revised August 1, 2017