ECE Course Outline

ECE6776

Integrated and Low-Cost Microelectronics Systems Packaging (3-0-3)

Prerequisites
None
Corequisites
None
Catalog Description
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ME and MSE 6776.
Textbook(s)
Tummala & Swaminathan, System on Package (SOP): Miniaturization of the Entire System (1st edition), McGraw Hill, 2008. ISBN 9780071459068 (required)

Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, 2001. ISBN 9780071371698 (required)

Topical Outline
Electronic Systems and Their Packaging
IC Evolution:  Current and Future
System-on-Chip:  Status and Challenges
Electronic Packaging Definition and Evolution of IC Packaging
- Cost, size, performance, reliability
Package Electrical Design
- Signal distribution, power distribution, delta-I noise, mixed-signal 
design
Package Thermomechanical Design
- Stress development, modeling, reliability
Electrical Test
- Testing and test methods at IC packaging level, board level, and system 
level
MCM and Micro-via Board
- Need for integration, materials, processes, and intelligent large area 
manufacturing
- Cost modeling, process modeling, latest HDW technologies
Discrete, Integrated, and Integral Components: Motivation, Status, and 
Challenges
Optoelectronic Integration:  Motivation, Status, and Challenges
RF Packaging:  Needs, Status, and Challenges
IC Packaging
- Wirebond, TAB, and flipchip status and challenges
Thermal Management
- IC power needs, cooling technologies, status and challenges
Reliability Technology