Process Steps

The Lab Environment

Safety

Lab Floorplan

Glossary

Process Steps (Based on ChE/EE 4752 Process Lab) Overview

Substrate Characterization

RCA Clean

Field Oxidation

Photolithography (P-Well Mask)

RCA Clean

P-Type Diffusion

RCA Clean

Photolithography (P+ Source/Drain Mask)

RCA Clean

P-Type Diffusion

RCA Clean

Field Oxidation

Photolithography (N+ Source/Drain Mask)

RCA Clean

N-Type Diffusion

Photolithography (Gate/Contact Mask)

RCA Clean

Gate Oxidation

Photolithography (Contact Mask)

RCA Clean

Metallization

Photolithography (lightfield Mask)

PAN Etching

Plasma Etching

Sintering/Annealing

Device Characterization

Device Cross-sections within Fabrication Process

Field Oxidation

Mask 1 -- P-Well

P-Well Boron Diffusion

Mask 2 -- P+ Source/Drain

Boron Predeposition

Field Oxidation & Drive-In

Mask 3 -- N+ Source/Drain

Phosphorus Predeposition

Mask 4 -- Active Areas

Gate Oxidation & Drive-In

Mask 5 -- Contacts

Metal Deposition

Mask 6 -- Metal Patterning