This is where Device Charactization takes place.
We use a Signatone Corporation M150 probe station, with a Tektronix 576 curve tracer and a Tektronix 571 curve tracer to print out our I-V plots on the Hewlett PAchard 7090A plotter.
On the left side of this picture is the Bonding and Packaging Area.
We use a Marpet Enterprise 1204W for bonding and packaging.
On the right side of this picture are the Nikon NMN microscopes used to examine the wafers. Both student snd instructor can look at the wafers at the same time.