The Interactive Electronics Packaging Website was created to introduce students to basic packaging substrate fabrication concepts and techniques. Historically, undergraduate education in elecronic packaging has lagged behind similar programs in semiconductor device physics and integrated circuit design, despite the fact that interconnection and packaging is among the most critical challanges facing the microelectronics industry today. As a result, individuals who arrive at careers in packaging usually do so by accident or by default.

To improve this situation, in-depth familiarization with packaging fabrication issues and the opportunity for hands-on "design, build, and operate" (DBO) education is believed to be essential. These packaging fabrication issues and the DBO aspect are addressed in a hands-on packaging laboratory which this site auguments. This web site, with its nonlinear nature and multimedia capabilities, provides interactive information access that greatly enhances the educational experience. The specific topics convered in this site include, but are not limited to, interconnect design, dielectric deposition, via formation, metallization, and interconnect testing. This interactive laboratory is geared toward senior undergraduates and 1st year graduates in electrical engineering, chemical engineering, physics, chemistry and materials science.

This web site and its accompanying hands-on laboratory operate in conjunction with the Packaging Research Center (PRC) at the Georgia Institute of Technology. The PRC is pursuing the goal of achieving strategic solutions in electronics packaging with multichip module technology as a focal point.