Georgia Institute of Technology
Packaging Research Center (PRC)

State University of New York at Binghamton
Integrated Electronics Engineering Center

University of Arizona at Tuscon
Center for Electronic Packaging Research

University of Arkansas at Fayetteville
High Density Electronics Center(HiDEC)

University of Colorado at Boulder
Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode)

Virginia Polytechnic Institute and State University
Microelectronics Laboratory