Madhavan Swaminathan, Ege Engin, Lixi Wan, and Prathap Muthana, "Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof," United States Patent: 7,504,706, 3/17/09.

Vinu Govind, Sidharth Dalmia, Amit Bavisi, Venkatesh Sundaram, Madhavan Swaminathan and George White,"Multi-band RF transceiver with passive reuse in organic substrates," United States Patent: 7,489,914, 2/10/09

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Methods for fabricating three-dimensional all organic interconnect structures ", United States Patent: 7260890, 8/28/2007

Jinwoo Choi, Madhavan Swaminathan, Vinu Govind "Mixed-signal systems with alternating impedance electromagnetic bandgap (AI-EBG) structures for noise suppression/isolation ", United States Patent: 7253788, 8/7/2007

Jinwoo Choi, Madhavan Swaminathan, Vinu Govind "Electromagnetic bandgap structure for isolation in mixed-signal systems ", United States Patent: 7215301, 5/8/2007

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Integrated passive devices fabricated utilizing multi-layer, organic laminates ", United States Patent: 7068124, 6/27/2006

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Stand-alone organic-based passive devices ", United States Patent: 6987307, 1/17/2006

George E. White, Madhavan Swaminathan, Venkatesh Sundaram, Sidharth Dalmia "Integrated passive devices fabricated utilizing multi-layer, organic laminates ", United States Patent: 6900708, 5/31/2005

Laertis Economikos, Mukta Shaji Farooq, Michael Ford McAllister, Eric Daniel Perfecto, Chandrika Prasad, Keshav Prasad, Madhavan Swaminathan, Thomas Anthony Wassick, George White"Thin film wiring scheme utilizing inter-chip site surface wirin", United States Patent: 6444919, 9/3/2002

Abijit Chatterjee, Bruce Kim, Madhavan Swaminathan "System, circuit, and method for testing an interconnect in a multi-chip substrate", United States Patent: 6111414, 8/29/2000

Eric Daniel Perfecto, Chandrika Prasad, Keshav Prasad, Gordon Jay Robbins, Madhavan Swaminathan, George Eugene White"Minimal capture pads applied to ceramic vias in ceramic substrates ", United States Patent: 5916451, 6/29/1999

Michael Ford McAllister, James Alexander McDonald, Gordon Jay Robbins, Madhavan Swaminathan, Gregory Martine Wilkins"Method of constructing an integrated circuit memory ", United States Patent: 5817543, 10/6/1998

Michael McAllister, James McDonald, Eric Daniel Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan, George Eugene White"Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure ", United States Patent: 5757079, 5/26/1998

Michael McAllister, Eric Daniel Perfecto, James McDonald, Keshav Prasad, Gordon J. Robbins, Chandrika Prasad, Madhavan Swaminathan, George Eugene White"Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages ", United States Patent: 5747095, 5/5/1998

Michael F. McAllister, James A. McDonald, Gordon J. Robbins, Madhavan Swaminathan, Gregory M. Wilkins"High density memory structure ", United States Patent: 5523619, 6/4/1996

Eric D. Perfecto, Chandrika Prasad, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan, George E. White "Minimal capture pads applied to ceramic vias in ceramic substrates ", United States Patent: 5464682, 11/7/1995

Michael F. McAllister, James A. McDonald, Keshav Prasad, Gordon J. Robbins, Madhavan Swaminathan "Thin-film wiring layout for a non-planar thin-film structure ", United States Patent: 5378927, 1/3/1995