Abhilash Goyal, Madhavan Swaminathan, Chirs Ward, George White, Abhijit Chatterjee; "A Novel Method for Testing Integrated RF Substrates,"IEEE Asia-Pacific Microwave Conference (APMC), December 2007 (PDF)

Goyal, Abhilash; Swaminathan, Madhavan; "A Low Cost Method for Testing Integrated RF Substrates,"2008 IEEE MTT-S International Microwave Symposium Digest, 15-20 June 2008 Page(s):387 - 390 (PDF)

Goyal, Abhilash; Swaminathan, Madhavan; "A low-cost test approach for embedded RF passive circuits,"2008. IMS3TW 2008. IEEE 14th International Mixed-Signals, Sensors, and Systems Test Workshop, 18-20 June 2008 Page(s):1 - 5 (PDF)

White, G.; Dalmia, S.; Carastro, L.; Russell, C.; Sundaram, V.; Swaminathan, M.; "A Novel Methodology (Low Temperature Laminated Organics) for 3D Integration Using Multilayer Organics,"2008. ECTC 2008. 58th Electronic Components and Technology Conference, 27-30 May 2008 Page(s):34 - 37 (PDF)

Engin, A.E.; Swaminathan, M.; "Power Transmission Lines: A New Interconnect Design to Eliminate Simultaneous Switching Noise"2008. ECTC 2008. 58th Electronic Components and Technology Conference, 27-30 May 2008 Page(s):1139 - 1143 (PDF)

Chandrasekhar, J.; Engin, E.; Swaminathan, M.; Uriu, K.; Yamada, T.; "Noise Induced Jitter in Differential Signaling"2008. ECTC 2008. 58th Electronic Components and Technology Conference, 27-30 May 2008 Page(s):1755 - 1761 (PDF)

Bharath, K.; Engin, E.; Swaminathan, M.; "Automatic Package and Board Decoupling Capacitor Placement Using Genetic Algorithms and M-FDM"2008. DAC 2008. 45th ACM/IEEE Design Automation Conference, 8-13 June 2008 Page(s):560 - 565 (PDF)

Bharath, Krishna; Sankaran, Nithya; Engin, A. Ege; Swaminathan, Madhavan; "Multi-Layer Fringe-Field Augmentations for the Efficient Modeling of Package Power Planes"2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 27-29 Oct. 2008 Page(s):331 - 334 (PDF)

Ki Jin Han; Swaminathan, M.; Ege Engin; "Electric Field Integral Equation Combined with Cylindrical Conduction Mode Basis Functions for Electrical Modeling of Three-dimensional Interconnects"2008. DAC 2008. 45th ACM/IEEE Design Automation Conference, 8-13 June 2008 Page(s):421 - 424 (PDF)

Ki Jin Han; Swaminathan, M.; Engin, E.; "Analysis of Horizontal and Vertical Couplings in Bonding Wire Interconnections Using EFIE with Cylindrical Conduction Mode Basis Functions"2008. SPI 2008. 12th IEEE Workshop on Signal Propagation on Interconnects, 12-15 May 2008 Page(s):1 - 4 (PDF)

Ki Jin Han; Swaminathan, M.; Engin, E.; "Electrical Modeling of Wirebonds in Stacked ICs Using Cylindrical Conduction Mode Basis Functions "2008. ECTC 2008. 58th Electronic Components and Technology Conference, 27-30 May 2008 Page(s):1225 - 1230 (PDF)

Ki Jin Han; Swaminathan, M.; Engin, E.; "Wideband Electrical Modeling of Large Three-Dimensional Interconnects using Accelerated Generation of Partial Impedances with Cylindrical Conduction Mode Basis Functions "2008 IEEE MTT-S International Microwave Symposium Digest, 15-20 June 2008 Page(s):1297 - 1300 (PDF)

Ha, Myunghyun; Srinivasan, Krishna; Swaminathan, Madhavan; "Chip-Package Co-Simulation with Multiscale Structures "2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 27-29 Oct. 2008 Page(s):339 - 342 (PDF)

Sankaran, N.; Ramdas, V.C.; Baik-Woo Lee; Sundaram, V.; Ege Engin; Iyer, M.; Swaminathan, M.; Tummala, R.; "Coupling Noise Analysis and High Frequency Design Optimization of Power/Ground Plane Stack-up in Embedded Chip Substrate Cavities "2008. ECTC 2008. 58th Electronic Components and Technology Conference, 27-30 May 2008 Page(s):1874 - 1879 (PDF)

Sankaran, Nithya; Huh, Suzanne; Swaminathan, Madhavan; Tummala, Rao; "Suppression of Vertical Coupling using Electromagnetic Band Gap Structures "2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 27-29 Oct. 2008 Page(s):173 - 176 (PDF)

Sung-Hwan Min,; Chung-Seok Seo,; Yepes, Ana M.; Ward, Chris; Dalmia, Sidharth; White, George; Swaminathan, Madhavan; "RF Design Methodology for Design-Cycle-Time Reduction using Parameterization of Embedded Passives on Multilayer Organic Substrates "2008 IEEE MTT-S International Microwave Symposium Digest, 15-20 June 2008 Page(s):1397 - 1400 (PDF)

Huh, Suzanne; Swaminathan, Madhavan; Muradali, Fidel; "Design, Modeling, and Characterization of Embedded Electromagnetic Band Gap (EBG) Structure"2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 27-29 Oct. 2008 Page(s):83 - 86 (PDF)

Bandyopadhyay, T.; Mehrotra, G.; Iyer, M.K.; Raj, P.M.; Swaminathan, M.; Tummala, R.R.; "Microwave Design & Characterization of a Novel Nano-Cu Based Ultra-fine Pitch Chip-to-Package Interconnect"2008. ECTC 2008. 58th Electronic Components and Technology Conference, 27-30 May 2008 Page(s):1242 - 1248 (PDF)

Laddha, Vishal; Swaminathan, Madhavan; "Correlation of PDN Impedance with Jitter and Voltage Margin for High Speed Channels"2008 IEEE-EPEP Electrical Performance of Electronic Packaging, 27-29 Oct. 2008 Page(s):73 - 76 (PDF)

Hwang, Seunghyun E.; Swaminathan, Madhavan; Venkatakrishnan, Venkatesan; "Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz"EDAPS 2008. Electrical Design of Volume , Issue , 10-12 Dec. 2008 Page(s):53 - 56 (PDF)

Sankaran, Nithya Swaminathan, Madhavan Tummala, Rao; "A novel method for suppression of vertical coupling in multi-layered substrates" Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of 10-12 Dec. 2008 page(s): 124-127 (PDF)

K. J. Han and M. Swaminathan; "Parasitic Extraction of Interconnections in 3-D Packaging Using Mixed Potential Integral Equation with Global Basis Functions" Asia-Pacific Microwave Conference (APMC), Dec. 2008 (PDF)