| An Industry - Academia Consortium |
MSDT
Mixed Signal Design Tools
Focus
The focus of this consortium
is the development
of next generation
design tools that
enable the deployment
of SiP (System in Package)
and SoP (System
on Package) technologies.
These tools will
interface with commercially
available package
layout tools and are
expected to seamlessly
fit into an existing
design flow. Along
with providing analysis
capability, they can also
be used to influence
designs in an iterative
manner. Hence, the
goal of the consortium
is to develop EDA tools
that enable both design
and verification.
Goal
Next Generation EDA
Tools for Integrated
Microsystems
Research Tasks:
1. Power Ground Network
Simulator and
Optimizer
2. Design for Manufacturing
Methods for
SIP
3. Automated Methods
for the Design of EP
4. Early exploratory Tool
for Chip-Package Co-
Design
5. EBG Modeling and
Synthesis
6. Modeling of Coupling in
3D Integration
7. Parametric Models of
Linear 3D Electrical
Interconnects and Packages
(EIP)
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