Muhannad S. Bakir, Hollie A. Reed, Paul A. Kohl, Kevin P. Martin, James D. Meindl, "Sea of Leads ultra-high density compliant wafer level packaging technology," in Proc. Electronic Components and Technol. Conf., 2002, pp. 1087-1094.

Best of Session Award: TECHCON 2000

S. Nugent, "An Ultra-Compact Empirical Model for Throughput Projection for Gigascale Integration," TECHCON 2000, Sept. 2000.

Best of Session Award: TECHCON 2000

A. Bhavnagarwala and J. Meindl, "Limits on CMOS SRAM Scaling", TECHCON 2000, Sept. 2000.

Best Student Paper Award: IITC 1999

J.A. Davis and J.D. Meindl," Length, Scaling, and Material Dependence of Crosstalk between Distributed RC Interconnects". Proc, IEEE International Interconnect Technology Conference, pp. 227-9, May 1999.

Best Paper Award: ASIC 1996

J. C. Eble, V. K. De, D. S. Wills, J. D. Meindl, "A Generic System Simulator (GENESYS) for ASIC Technology and Architecture Beyond 2001", Proc., Ninth Annual IEEE International ASIC Conference, pp. 193-196, Sept. 1996.