PRC Base SOP Consortium Meeting

Dear colleagues,

It is our pleasure to invite you to attend the Microsystems Packaging Research Center's (PRC) Base SOP consortium meeting to be held at the Manufacturing Research Center (MaRC) on the Georgia Tech campus, September 15th, 2008. You are invited to bring one or two additional colleagues from your company to cover your broader needs in the PRC's broad set of research programs.

Conveniently scheduled during the week, after the Monday Base SOP meeting, is the Next Generation Flip Chip (NGFC) consortium workshop. This new workshop is open to industry participants and is free of charge. The IAB meetings for Thermal Interface Materials (TIM), Embedded Actives & Passives (EMAP), and Mixed Signal Design Tools (MSDT) will also be held during the week, reserved for members only.

(Note: The 3D All Silicon System Module (3DASSM) final workshop has been postponed until October 28-29, 2008 European company schedule conflicts. The BioSOP consortium workshop will be postponed until further notice. Please check back soon.)

You can view the entire week of events on our Industry Week At-A-Glance.

To the public events, we welcome senior engineers, managers, scientists from companies involved in semiconductor, electronic systems, energy, biotech, automotive, defense and aerospace industries.

To our Base SOP Consortium members, we invite you to make the NGFC consortium workshop a part of your visit. For information on other PRC consortia development workshops, please click here.

We look forward to seeing you in September!

Rao Tummala
Director, Packaging Research Center

NOTE: For Base SOP Consortium attendees, please be sure that either the primary or secondary representative from your company is present, preferably both. Other senior engineers, managers and decision makers from your company may also attend.

Hotels & Accommodations
The following hotels are near the meeting location:

Visitor Travel Information

Regency Suites Hotel
975 West Peachtree Street
Atlanta, GA 30309
PH: 404-876-5003.
Rate: $95.00 per night + tax. (Mention Georgia Tech Packaging Research Center for this rate.)

Marriott Courtyard Atlanta Midtown, 1132 Techwood Drive, Atlanta, Georgia 30318
PH: 404-607-1112. Special Rate for 15 or more Georgia Tech event registrants: $104.00 + tax. Further information

Renaissance Atlanta Hotel Downtown, 590 West Peachtree Street, NW, Atlanta, GA 30308, 404-881-6000. Rate: $125.00 per night + tax.

Georgia Tech Hotel, 800 Spring Street, NW, Atlanta, Georgia, 30308, PH: 404-347-9440. Rate: $129.00 per night + tax.

Contact Information:

Phone: 404-894-5233
FAX: 404-894-3842
E-mail: prcinfo@ece.gatech.edu

Postal Address:
Microsystems Packaging Research Center
813 Ferst Street, Room 351
Atlanta, GA 30332-0560

GENERAL CHAIR:
Rao Tummala, Georgia Institute of Technology,
rao.tummala@ece.gatech.edu

ORGANIZING COMMITTEE:
Patricia Allen, patricia.allen@ece.gatech.edu
Dean Sutter, dean.sutter@ece.gatech.edu

Updates and Information
(Last update: January 8, 2009 )

Attire: Business Casual

Presentations will be provided on CD-ROM. Please bring laptop computer if you wish to follow along.

PRC INDUSTRY WEEK
September 15-19, 2008

View At-A-Glance

September 15 (Monday), 2008

Download Agenda (PDF)

9:30~10:00 AM - Get together at Morning Coffee and Beverages, MaRC Atrium

10:00 AM~12:00 Noon: One-on-One Meetings on Company Projects

Member Companies - PRC Faculty, Project Leaders and Students/Engineers

ATOTECH - Prof. Tummala, Venky Sundaram and Hunter Chan

Intel - Profs. Chang and Tummala and Fuhan Liu

NTK - Prof. Tummala, Raj Pulugurtha and

IBM - Prof. Sitaraman and Prof. Swaminathan

STW - Profs. Wong and Sitaraman, and Jack Moon

Rogers - Prof. Tummala, and Fuhan Liu

SAMEER - Profs. Tummala and Swaminathan, and Venky Sundaram

SONY - Prof. Swaminathan

Indium - Prof. Wong and Jack Moon

Lunch: 12:00~1:00 PM, MaRC Atrium

1:00~4:45PM – Research Programs Review and Business Meeting
Chair, Frank Pompeo, IBM

1:00~1:30 PM SESSION 1 - Welcome, PRC Programs, PRC Team and Research Highlights - Prof. Rao Tummala

1:30~4:45 PM SESSION 2 - Review of Base SOP Company Projects

Session A 1:30~2:15 PM, SOP Design: Chair, Dr. M. Swaminathan

Paper 1 - “Correlation of PDN Impedance with Jitter and Voltage Margin-SONY”, Prof. Swaminathan (15 min)
Paper 2 - “High Density Packaging and SOP Test Vehicle and Technology Test Vehicles-SAMEER”, Venky Sundaram and Profs. Swaminathan and Tummala (15 min)
Paper 3 - New Project: “DC Modeling and Tool Development for 3D Silicon Packaging” –IBM, Prof. Swaminathan (15 min)

Session B 2:15~3:00 PM, SOP Substrate Integration: Chair, Venky Sundaram

Paper 4: “Micro-vias and Fine Lines on ATOTECH RCF and RRCF-ATOTECH”, Hunter Chan, Venky Sundaram and Prof. Tummala (15min)
Paper 5 “Low Loss Thin Film Build-up Dielectrics for Next Generation Package Substrates-Rogers”, Fuhan Liu, Venky Sundaram and Prof. Tummala (15 min)
Paper 6 “High Density Optical Interconnects-Intel”, Prof. Chang (15 min)

Coffee and Break: 3:00~3:15 AM

Session C: 3:15~3:45 PM, Interconnection and Assembly, Chair, Raj Pulugurtha

Paper 7 - “Electrical Reliability of Sol-gel BT Capacitor on Copper Foil-NTK/NGK”, Raj Pulugurtha, and Prof. Tummala (15 min)
Paper 8 - “Fine Pitch Flip Chip Packaging with Cu-based Interconnections, Raj Pulugurtha, Janagama Goud and Prof. Tummala (15 min)

Session D 3:45~4:45 PM, Materials and Reliability, Chair, Jack Moon

Paper 9 - “Warpage Prediction and Analysis – STW", Jack Moon and Prof. Wong (15 min)
Paper 10 - “ECA-Indium”, Jack Moon and Prof. Wong (15 min)
Paper 11 - New Project: "Coupled Moisture and Thermal Modeling" – IBM Prof. Sitaraman (15 min)

4:45~5:35 PM SESSION 3 PRC Membership Administration
Chair, Prof. Rao Tummala

New Graduated Scale Membership Structure – Mr. Dean Sutter – 20 Minutes

5:35~6:00 PM SESSION 4: Discussion & Wrap UP
Chair, Frank Pompeo, IBM

Q&A: Profs. Tummala and Swaminathan, and Dean Sutter

6:15-7:00PM Industry Social and Dinner:

Gordon Biersch Restaurant
848 Peachtree Street, NE
Atlanta, GA 30308

Gordon Bierch Restaurant

(Transportation Provided as Needed)


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