PRC INDUSTRY WEEK AT-A-GLANCE

September 15, 19, 2008 • Georgia Tech Campus, Atlanta, GA
Last update: August 28, 2008

Download At-A-Glance (PDF). Please return for frequently updated information.

 
 
MONDAY
September 15
TUESDAY
September 16
WEDNESDAY
September 17
THURSDAY
September 18
FRIDAY
September 19

M

O

R

N

I

N

G
Base SOP Consortium
EMAP Consortium
EMAP Consortium
NGFC Consortium
MSDT Consortium
MaRC Auditorium | INFO & REGISTRATION
MaRC Auditorium | INFO & REGISTRATION
MaRC Auditorium | INFO & REGISTRATION
MaRC Auditorium | INFO & REGISTRATION | Agenda
MaRC Room 114 | INFO & REGISTRATION

9:30~10:00 AM Get together at Morning Coffee and Beverages (MaRC Atrium)

10:00 AM~12:00 Noon: One-on-One Meetings on Company Projects

Member Companies   PRC Faculty, Project Leaders and Students/Engineers

  • ATOTECH - Prof. Tummala, Venky Sundaram and Hunter Chan
  • Intel - Profs. Chang and Tummala and Fuhan Liu
  • NTK - Prof. Tummala, Raj Pulugurtha and
  • IBM - Prof. Sitaraman and Prof. Swaminathan
  • STW - Profs. Wong and Sitaraman, and Jack Moon
  • Rogers - Prof. Tummala, and Fuhan Liu
  • SAMEER - Profs. Tummala and Swaminathan, and Venky Sundaram
  • SONY - Prof. Swaminathan        
  • Indium - Prof. Wong and Jack Moon

Lunch: 12:00~1:00 PM, MaRC Atrium

(See afternoon schedule for remaining activities.)

 

8:00 – 8:30 AM - Continental Breakfast

8:30 – 8:45 AM - Welcome and Objectives – Prof. Rao Tummala

8:45 – 9:15 AM - EMAP Program Year 2 Integration Summary, Timeline, Accomplishments, and Challenges – Venky Sundaram

SESSION 1 Year 2 Integration Test Vehicles Accomplishments and Status – Venky Sundaram and Prof. Rao Tummala

TASK 7: EMBEDDED ACTIVE TV

9:15 – 10:00 AM - Electrical Design

  • Power/Ground and Transmission Line Design - Prof. Swaminathan, Nithya Sankaran
  • Materials Characterization - Prof. Swaminathan, Eddy Hwang

Coffee Break 10:00 – 10:15 AM

10:15 – 11:15 AM - Ultra-Thin Substrate

  • Thin Core Substrate – Hunter Chan
  • Build-up Dielectric Materials and Processes – Fuhan Liu

11:15 – 12:00 PM - Embedded Actives in Substrate Cavity – Baikwoo Lee, Nithya Sankaran

8:00 – 8:30 AM - Continental Breakfast

SESSION 2 – Industry Feedback Session - Venky Sundaram and Prof. Rao Tummala

(FULL MEMBERS ONLY)

8:30 – 9:30 AM - Industry Feedback on Phase 1, Year 2 Research Program
IAB Chair (Mario Bolanos, TI) and Vice Chairs (Gerd Riha, Epcos & Bernd Roemer, Infineon)

9:30 – 10:30 AM - Proposal for EMAP Phase 2 (2009-2011)

10:30 – 11:30 AM - Finalization of Draft Technical Scope for Phase 2 Program - IAB Chair and Co-Chair, Venky Sundaram, Prof. Rao Tummala

11:30 AM – 12:00 PM - Wrap-up and Action Items Review

12:00 PM - Program Review Complete

Lunch 12:00 – 1:00 PM

Morning Coffee (8:00 am to 8:30 am)

Welcome and Objectives (8.30 am – 9:00 am)

  • Consortia and Workshop Objectives – Sitaraman
  • Introduction to PRC and its programs – Tummala

SESSION 1 (9:00 am – 10:00 am)
Industry Perspective

  • Industry Talk 1
  • Industry Talk 2

Coffee Break (10:00 am – 10:20 am)

SESSION 2 (10:20 am – 11:40 am)
Current and Proposed Research

  • Novel UBM and Interconnects – Raj
  • Novel Underfills – Wong
  • Next Generation Organic Substrates – Sundaram
  • Design and Simulation of Module Warpage – Sitaraman

LUNCH and Facility Tour (11:40 pm – 1:00 pm)

SESSION 3 (1:00 pm – 1.40 PM)
Current and Proposed Research

  • ECAD to MCAD Integration – Peak
  • Warpage Reduction and Targets – Sitaraman

SESSION 4 (1:40 – 2:00 pm)
Consortium Development

  • Program Schedule – Kumbhat
  • IP Management and membership fee – Sutter

SESSION 5 (2:00pm – 2:30 pm)
Industry Feedback and Wrap-up – Sitaraman & Tummala

Adjourn (2:30 pm)

SESSION 2: EDA for RF

8:00am – 8:30am Continental Breakfast

8:30am – 8:40am Overview – Prof. Madhavan Swaminathan

8:40am – 9:30am MSDT 3: Automated methods for the design of EP

3.1: Technical Presentation – Narayanan T V (20 min)
Q&A (5 min)
3.2: Technical Presentation – Mohit Pathak and Prof. SungKyu Lim (20 min)
Q&A (5 min)

9:30am – 9:55am MSDT 7: Parametric models of Linear 3D Electrical Interconnects and Packages (EIP)

Technical Presentation – Prof. Stefano Grivet, U. of Torino (20 min)
Q&A (5 min)

9:55am – 10:10am  Break

10:10am – 11:40am Demo (MSDT 3 and 7)

SESSION 3: EDA for 3D Multiscale Integration

11:40am – 11:50am Overview – Prof. Madhavan Swaminathan

11:50am – 12:15pm MSDT 4: EM Simulator for Chip-Package Co-Design

Technical Presentation – Myunghyun Ha (20 min)
Q&A (5 min)

12:15pm – 12:40pm MSDT 6: Modeling of Coupling in 3D Integration

Student Presentation – KiJin Han (20 min)
Q&A (5 min)

Lunch 12:40 pm to 1:30pm
 
LUNCH
LUNCH
LUNCH
LUNCH
LUNCH

A

F

T

E

R

N

O

O

N
TIM Consortium

Lunch 12:00 – 1:00 PM

1:00 – 1:45 PM - Chip-last Cu Bump Interconnections

Test Die Design & Fabrication – Pradeep Dixit, Ritwik Chatterjee

Assembly and Reliability – Nitesh Kumbhat

1:45 – 2:15 PM - Summary of Embedded Active TV and IAB Feedback

TASK 1.2: EMBEDDED PASSIVE TV         

2:15 – 3:00 PM - Design, Fabrication and Characterization – Prof. Swaminathan, Eddy Hwang

Coffee Break 3:00 – 3:15 PM

OTHER PROJECTS in YEAR 2

3:15 – 3:40 PM - 3.2: Thin Silicon Handling – Zhang Xiao Wu, Kripesh Vaidyanathan IME Singapore

3:40 – 4:05 PM - 4.1: Advanced Passive Cooling Technology – Prof. Yogendra Joshi

4:05 – 4:30 PM - 5.1: Embedded RF MEMS Switch – Prof. John Papapolymerou, Swapan Bhattacharya, Negar

4:30 – 4:55 PM - 6.1: n-ACF/NCF Materials – Prof. C. P. Wong, Jack Moon, Rongwei Zhang

4:55 – 6:15 PM - Supply Chain Participation in Integration TVs (Details to be finalized)

6:15 – 8:00 PM - Student Poster Session and Buffet Dinner (MaRC Atrium)

  
MSDT Consortium

1:30pm – 2:30pm Demo (MSDT 4 and 6)

SESSION 4: MSDT Phase 2

2:30pm – 3:30pm Phase 2 Discussions

3:30pm – 3:45pm Break

SESSION 5: IAB Feedback

3:45pm – 4:00pm Industry feedback on MSDT tools (Panasonic and SAMEER)
4:00pm – 4:45pm Closed door IAB – Lead: Dr. Jochen Reisinger (Infineon) and Dr. Karl Wagner (EPCOS)

4:45pm – 5:30pm Industry Feedback

5:30pm – 6:00pm Wrap – Up

6:30pm Dinner (Georgia Tech Hotel or elsewhere – TBD)

Demos:

MSDT 1 (Krishna Bharath)
MSDT 2 (Ranjeeth Doppalapudi)
MSDT 3.1 (Narayanan T V)
MSDT 3.2 (Mohit Pathak)
MSDT 4 (Myunghyun Ha)
MSDT 5 (Bernie Jord Yang)
MSDT 6 (KiJin Han)
MSDT 7 (Prof. Stefano Grivet Talocia)

Demos will provide details on Input/Output/Interface Formats and will apply the tool to several examples discussed in the presentation

MSDT Posters:

MSDT 1 (Krishna Bharath)
MSDT 2 (Ranjeeth Doppalapudi)
MSDT 3.1 (Narayanan T V)
MSDT 3.2 (Mohit Pathak)
MSDT 4 (Myunghyun Ha)
MSDT 5 (Bernie Jord Yang)
MSDT 6 (KiJin Han)
MSDT 7 (Prof. Stefano Grivet)

Whole program (Prof. Madhavan Swaminathan and Dr. Daehyun Chung)

Non-MSDT Posters:

RF / Mixed-Signal (Nevin Altunyurt, Abhilash Goyal, Eddy SeungHyun Hwang, Suzanna Huh, Dr. Daehyun Chung)

3 posters

Digital Integration (Aswani Kurra, Vishal Laddha, Nithya Sankaran, Tapobrata Bandyopadhyay, Rishiraj Bheda, Jianyong Xie, Sukruth Pattanagiri, Dr. Daehyun Chung)

3 posters
MaRC Room 114 | INFO & REGISTRATION
  
MaRC Room 114 | INFO & REGISTRATION

Registration: 11:30 AM~12 Noon, MaRC Atrium

Lunch: 12:00~1:00 PM, MaRC Atrium

1:00~1:20 PM: Welcome and Introduction—Prof. Yogendra Joshi

1:20~4:45 PM

SESSION 1: TIM Research Projects Review—Chair, Profs. Bahgat Sammakia and Jianmin Qu

Task 1: TIM Materials and Interfaces

  • Project 1.1: The Development of Aligned Carbon Nanotube Films For Thermal Interface Material Applications—Profs. C. P. Wong and Sam Graham (50 min)

Task 2 and 3: TIM Assembly and Bonding, and Characterization of TIM

  • Project 2.1: Assembly and Testbed Research with Metal and Metal Composite TIM—Dr. Raj Pulugurtha, Gopal Jha, Janagama Goud and Prof. Rao Tummala (25 min)

Coffee Break: 2:35~3:05 PM

  • Project 3.1: Thermal and Thermomechanical Modeling and Characterization of TIMs and Their Interfaces—Profs. Yogendra Joshi, Bahgat  Sammakia and Jianmin Qu (75 min)

Task 4: TIM Reliability:

  • Project 4.1: Design for Reliability of Thermal Interface Materials—Prof. Suresh Sitaraman (25 min)

4:45~5:30 PM:

SESSION 2: Year 2 plans and Wrap-up Discussion - Chair, Prof. Yogendra Joshi

Industry Dinner: 6:30PM~8:30 PM, Georgia Tech Hotel

  

1:30pm – 2:00pm Welcome and Overview – Prof. Madhavan Swaminathan

SESSION 1: EDA for Digital and Mixed Signal

2:00pm – 2:15pm Overview – Prof. Madhavan Swaminathan

2:15pm – 2:40pm MSDT 1: Power Ground Network Simulator and Optimizer
Technical Presentation – Krishna Bharath (20 min)
Q&A (5 min) 

2:40pm – 3:05pm MSDT 2: Design for Manufacturing Methods for SiP
Technical Presentation – Ranjeeth Doppalapudi (20 min)
Q&A (5 min)

3:05pm – 3:30pm MSDT 5: EBG Modeling and Synthesis
Technical Presentation – Bernie Jord Yang (20 min)
Q&A (5 min)

3:30pm – 3:45pm Break

3:45pm – 5:15pm Demo (MSDT 1, 2 and 5)
5:15pm – 6:15pm Poster Session
6:30pm Dinner (Georgia Tech Hotel or elsewhere - TBD)
IAB Conference
MaRC Auditorium | INFO & REGISTRATION

1:00~4:45PM – Research Programs Review and Business Meeting - Chair, Frank Pompeo, IBM

SESSION 1

1:00~1:30 -  Welcome, PRC Programs, PRC Team and Research Highlights - Prof. Rao Tummala

SESSION 2

1:30~4:45 PM: Review of Base SOP Company Projects

SUB-SESSION A  1:30~2:15 PM, SOP Design - Chair, Dr. M. Swaminathan

  • Paper 1: “Eye Diagram Improvement-SONY”, Prof. Swaminathan (15 min)
  • Paper 2 “High Density Packaging and SOP Test Vehicle and Technology Test Vehicles-SAMEER”, Venky Sundaram and Profs. Swaminathan and Tummala (15 min)
  • New Project: “DC Modeling and Tool Development for 3D Silicon Packaging” –IBM, Prof. Swaminathan (15 min)

SUB-SESSION B  2:15~3:00 PM, SOP Substrate Integration - Chair, Venky Sundaram

  • Paper 3: “Micro-vias and Fine Lines on ATOTECH RCF and RRCF-ATOTECH”, Hunter Chan, Venky Sundaram and Prof. Tummala (15min)
  • Paper 4 “Low Loss Thin Film Build-up Dielectrics for Next Generation Package Substrates-Rogers”, Fuhan Liu, Venky Sundaram and Prof. Tummala (15 min)
  • Paper 5 “High Density Optical Interconnects-Intel”, Fuhan Liu and Profs. Chang and Tummala (15 min)

Coffee and Break: 3:00~3:15 AM

SUB-SESSION C: 3:15~3:45 PM, Interconnection and Assembly - Chair, Raj Pulugurtha

  • Paper 6 “Electrical Reliability of Sol-gel BT Capacitor on Copper Foil-NTK/NGK”, Raj Pulugurtha, and Prof. Tummala (15 min)
  • Paper 7 “Fine Pitch Flip Chip Packaging with Cu-based Interconnections, Raj Pulugurtha, Janagama Goud and Prof. Tummala (15 min)

SUB-SESSION D  3:45~4:45 PM, Materials and Reliability - Chair, Jack Moon

  • Paper 8 “Warpage Prediction and Analysis – STW and LGE”, Prof. Sitaraman, Jack Moon, and Prof. Wong (15 min)
  • Paper 9  “System-Level Design of Multi-Chip Module- IBM”, Kevin Klein and Prof. Sitaraman (15 min)
  • Paper 10 “ECA-Indium”, Jack Moon and Prof. Wong (15 min)
  • New Project: Reliability Prediction Model and Design Methodology for Multi-Chip Microelectronic Packages – IBM Prof. Sitaraman (15 min)

SESSION 3

4:45~5:35 PRC Membership Administration - Chair, Prof. Rao Tummala

  • Invention Disclosures for Membership Patent Support – Mr Dean Sutter – 20 Minutes
  • New Graduated Scale Membership Structure – Mr. Dean Sutter – 20 Minutes

SESSION 4

5:35~6:00 PM: Discussion & Wrap UP - Chair, Frank Pompeo, IBM

  • Q&A: Profs. Tummala and Swaminathan, and Dean Sutter
  • Industry Social:  6:15-7:00PM Georgia Tech Hotel Lounge Area
  • Industry Dinner: 7:00-8:30PM Georgia Tech Hotel Dining Area