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EVENTS
Upcoming
PRC Spring IAB / Industry Week April 20-22, 2010
Come visit us at the 2010 60th ECTC - Booth #316 (near refreshments) June 2-3, 2010
Come visit us at the 2010 Semicon West - Booth (Location coming soon)
July 13-15, 2010
Recent
Visitor
Travel Info
Full-time Post-Doc Research Opportunity- offered by:
Click here for more info..
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RESEARCH
Core Technologies
Base System-On-Package (Base SOP)
Mixed Signal Design & Tools
Embedded Actives & Passives
Next Generation Thermal Interface Materials
3D All Silicon System Module
Newsletter
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Books
"Introduction to System-on-Package
(SOP)", the first textbook on SOP.
Figures
New People at PRC
Himani Sharma - Post Doctoral Fellow
Cristina Scelsi - Research Process Engineer
Robert Bonasewicz - Intern from Technical University of Warsaw and Technical University of Dresden
Mateusz Jarosz - Intern |
ACCESS
Industry Members
Membership Programs
Consortia Development
Bylaws (pdf)
Membership Agreement (pdf)
Full Member Login
- EMAP | MSDT | TIM
EMAP II | MSDT II
3D Interposer I
Supply Chain Login
- 3D Interposer I
EMAP I
- EMAP II
Students
ECE 6776 Login
MSE4754 Login
Full-time Jobs & Internships
Packaging Courses
ECE/ChBE/MSE 4755 (pdf) - Design-Build-Operate (DBO1)
ECE/ME/MSE 6776 (pdf) - Introduction to SOP, SIP, 3D and SOC. |
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Welcome
to the
Georgia Tech Microsystems
Packaging Research Center
Prof. Rao R. Tummala,
Founding Director |
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PRC Vision:
Second Law of Electronics by System-On-Package (SOP)
Unlike
Moore 's Law, the first law of electronics, which integrates
at IC level, PRC's vision of SOP, System-On-Package (or
module) is the Second Law of Electronics for System Integration.
SOP is a highly miniaturized system
technology combining computing, communication, consumer, and
bio-electronic functions in a single package or module. It
accomplishes this miniaturization by package integration of system-level
components at microscale in the short term and nanoscale
in the long term.
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Click to enlarge |
Applications
of SOP:
Digital
convergence, consumer electronics, 3G and beyond communications,
health care, safety, and security.
Research Areas of
SOP: Mixed
signal design, test, materials, processes, assembly, thermal
and reliability.
Education in SOP: Undergraduate
and graduate courses, curricula, textbooks, research and degrees at
BS, MS and Ph.D. levels.
Industry Collaborations
in SOP: More
than 70 companies collaborate from US, Europe, Japan, Korea,
India and Singapore.
Infrastructure
in SOP: $50 M state-of-the-art
facilities in design, fabrication, assembly, test and reliability.
Faculty
and Students: 20
faculty and more than 100 graduates and undergraduate students from
ECE, MSE, ME and ChE.
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