Faculty Profile - Rao R Tummala
|Professor; Joseph M. Pettit Chair in Electronics Packaging; Director, NSF Packaging Research Center; GRA Eminent Scholar|
Office: MARC 352
Selected Publications, Patents
- Tummala, R. R., Editor & Author, "Introduction to System-on-Package", McGraw-Hill, 2007.
- Tummala, R.R., P. Markondeya Raj, Venky Sundaram, Chong Yoon, Mahadevan Iyer, "SOP for multifunctional system packages", Advanced Packaging, July 2005.
- Tummala, R.R., "Moore's Law Meets Its Match", IEEE Spectrum magazine, June 2006.
- Tummala, R.R., "System-on-Package Integrates Multiple Tasks", February 2004.
- Tummala, R.R., Joy Laskar, "Gigabit wireless: System-on-Package technology," Proceedings of the IEEE, Vol. 92, 2004, pp. 376-387.
- Tummala, R.R., Editor and Author, "SOP: What is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade", IEEE Transactions on Advanced Packaging, vol. 27, no 2, pp. 241-249, 2004.
- Tummala, R.R., Manos Tentzeris, Joy Laskar, Gee-Kung Chang, Suresh Sitaraman, David Keezer, Daniel Guidotti, Zhaoran Huang, Kyutae Lim, Lixi Wan, Swapan Bhattacharya, Venkatesh Sundaram, Fuhan Liu, and P. Markondeya Raj, "The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade", IEEE Transactions on Advanced Packaging, vol. 27, no 2, pp. 250-267, 2004.
- Tummala, Venky Sundaram, Fuhan Liu, Sidharth Dalmia, Joseph Hobbs, Erdem Matoglu, Mekita Davis, George White, Joy Laskar, Madhavan Swaminthan, Nan-Marie Jokerst, Toshihisa Nonaka, "Digital, RF and Optical Integration in System-on-a-Package (SOP) for Convergent Systems", ICEP 2002, Tokyo, Japan, June 2002.
- Tummala R. R., Editor and Author, Fundamentals of Microsystems Packaging, McGraw Hill, June 2001.
- R. R. Tummala, V. K. Madisetti, System on Chip or System on Package, IEEE Design & Test of Computers, Vol. 16, No. 2, pp. 48-56, April 1999.
- Tummala, R.R., co-editor and author, Microelectronics Packaging Handbook, 3 volumes, Chapman Hall, 1996.
- Tummala, R. R., Multichip Packaging A Tutorial, Proceedings of IEEE, Vol. 80, pp. 1924-1941, Dec. 1992
- Tummala, R.R., Ceramic and Glass-Ceramic Packaging in the 1990s, Journal of American Ceramic Society, Vol. 74, pp. 895-908, 1991.
- Tummala, R. R., editor & author, Microelectronics Packaging Handbook, Van Nostrand, 1989.
Last revised on June 06, 2008.