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Faculty Profile - Muhannad S Bakir

Associate Professor; Associate Director, Interconnect and Packaging Center; ON Semiconductor Junior Professorship in Analog Integrated Circuit Design
Microelectronics/Microsystems

Phone: 4043856276
Fax: 404.894.4641
Office: MiRC 131

http://users.ece.gatech.edu/~mbakir/

Biography

Muhannad S. Bakir received the B.E.E. degree (summa cum laude) from Auburn University, Auburn, AL, in 1999 and the M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology (Georgia Tech) in 2000 and 2003, respectively.

He was a senior research engineer at the Nanoelectronics Research Center at Georgia Tech from 2003-2010. He is the editor of a book entitled Integrated Interconnect Technologies for 3D Nanoelectronic Systems and is the author/coauthor of more than 60 journal publications and conference proceedings, 5 book chapters, 12 US patents, multiple invited presentations, and the presenter of 2 conference tutorials, including an invited tutorial on 3D technology at the 2007 International Solid-State Circuits Conference (ISSCC).

Selected Publications, Patents

Research Interests
  • Three-dimensional (3D) electronic system integration
  • Advanced cooling and power delivery for 3D systems
  • Biosensor technologies and their integration with signal processing circuitry
  • Carbon based nanoelectronics
  • Nanofabrication technology
  • Novel interconnect systems
Distinctions
  • 2012 DARPA Young Faculty Award
  • 2012 National Academy of Engineering Frontiers of Engineering Symposium Invited Participant
  • 2011 IEEE CPMT Outstanding Young Engineer Award
  • Semiconductor Research Corporation (SRC) Inventor Recognition Awards (2002, 2005, 2009)
  • Associate Director of the Georgia Tech Interconnect and Packaging Center (IPC), an SRC Center of Excellence
  • Best Invited Paper Award from the 2007 IEEE Custom Integrated Circuits Conference (CICC)
  • Best Paper Award from the 2002 Electronic Components and Technology Conference (ECTC)
  • Outstanding Paper Award from the 2007 Electronic Components and Technology Conference (ECTC)
  • Co-recipient of the Best Student Paper Awards from the 2005, 2006, 2008 IEEE International Interconnect Technology Conference (IITC)
  • Co-recipient of the Motorola Electronic Packaging Student Paper Award from the 2008 Electronic Components and Technology Conference (ECTC)
  • Co-recipient of the SRC TECHCON 2009 Best in Session Paper Award
  • Co-recipient of the Best Student Paper Award from the 2009 International Symposium on Microelectronics
  • Twelve issued US Patents
  • Member of the International Technology Roadmap for Semiconductors (ITRS)
  • Associate Editor for IEEE Transactions on Electronics Packaging Manufacturing

Last revised on September 06, 2012.