|Course Number||Course Title and Catalog Description|
| ECE3040 ||Microelectronic Circuits|
Basic concepts of microelectronic materials, devices and circuits.
| ECE3043 ||Measurements, Circuits and Microelectronics Laboratory|
Basic electronic test instrumentation. Elementary passive and active circuits using both discrete (diodes, bipolar junction transistors, MOSFETs) and integrated devices (operational amplifiers).
| ECE3450 ||Semiconductor Devices|
Properties of semiconductor devices. Applications in current and future computers, fiber optic and wireless communication systems. Future needs of high frequency, GHz-range, device operation.
| ECE4451 ||Semiconductor Devices for Wireless & Fiber Communication|
Advanced development of semiconductor device theory focusing on optoelectronic emitters, detectors, & high frequency transistors to provide an understanding of devices used in communications systems
| ECE4452 ||Integrated Circuit Fabrication|
Introduction to microelectronic processing technologies and CMOS. Includes a laboratory for fabrication/testing of MOS transistors, basic CMOS circuits, integrated resistors and capacitors.
| ECE4460 ||Introduction to Electronic Systems Packaging|
Introduction to packaging technologies, technology drivers, electrical performance, thermal management, materials, optoelectronics, RF integration, reliability, system issues, assembly, and testing.
| ECE4752 ||Integrated Circuit Fabrication|
The objective of this course is to give students exposure to the various steps involved in the fabrication of integrated circuits and devices. 'The course will include a laboratory segment in which students fabricate MOS transistors, diffused resistors and MOS capacitors from a bare silicon substrate. Crosslisted with CHE 4752.
| ECE4754 ||Electronics Packaging Assembly, Reliability, Thermal Management, and Test|
The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems. Crosslisted with ME and MSE 4754.
| ECE4755 ||Electronic Packaging Substrate Fabrication|
This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. Crosslisted with CHE 4755.
| ECE6444 ||Silicon-Based Heterostructure Devices and Circuits|
Theory and design of novel silicon-germanium microelectronic devices and circuits. Materials, device physics, fabrication, measurement, circuit design, and system applications.
| ECE6450 ||Introduction to Microelectronics Technology|
Presents the fundamentals of microelectronics material, device, and circuit fabrication
| ECE6451 ||Introduction to the Theory of Microelectronics|
Basis of quantum mechanics, statistical mechanics, and the behavior of solids to serve as an introduction to the modern study of semiconductors and semiconductor devices.
| ECE6453 ||Theory of Electronic Devices|
Presents the fundamentals of electronic device operation
| ECE6455 ||Semiconductor Process Control|
This course is designed to explore methods of applying statistical process control and statistical quality control to semiconductor manufacturing processes. Students will be required to complete a design project.
| ECE6456 ||Solar Cells|
To provide a practical understanding of semiconductor materials and technology as it relates to design and development of efficient solar cells and photovoltaic systems.
| ECE6458 ||Gigascale Integration|
Hierarchy of physical principles that enable understanding and estimation of future opportunities to achieve multibillion transistor silicon chips using sub-0.25 micron technology.
| ECE6460 ||Microelectromechanical Devices|
Fundamental concepts for design of microelectromechanical devices (MEMS), including mechanical and thermal behavior of materials and structures, transduction principles, transducer design, and modeling.
| ECE6542 ||Optoelectronics: Devices, Integration, Packaging, Systems|
Optoelectronic devices (detectors, emitters, modulators) from the practical realized and theoretical performance perspective. Explores monolithic and hybrid integration of devices, packaging and system implementation.
| ECE6759 ||Plasma Processing of Electronic Materials and Devices|
Fundamental physics, chemistry, chemical engineering and electrical engineering principles inherent in plasma processes. Includes etching, deposition, diagnostic methods, and control schemes. Cross-listed with CHE 6759.
| ECE6771 ||Optoelectronics: Materials, Processes, Devices|
Optoelectronic materials, physical processes, and devices. Includes compound semiconductor materials, excitation, recombination, gain, and modulation processes and devices such as emitters, detectors, and modulators. Crosslisted with PHYS 6771.
| ECE6776 ||Integrated and Low-Cost Microelectronics Systems Packaging|
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ME and MSE 6776.
| ECE6779 ||Thermal Engineering for Packaging of Micro and Nano Systems|
Passive, active, and hybrid thermal management techniques, and computational modeling of micro systems. Air cooling, simlge phase and phase change liquid cooling, heat pipes, and thermoelectrics. Crosslisted with ME 6779.