ECE Courses

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Course Number  Course Title and Catalog Description
Microelectronic Circuits
Basic concepts of microelectronic materials, devices and circuits.
Measurements, Circuits and Microelectronics Laboratory
Basic electronic test instrumentation. Elementary passive and active circuits using both discrete (diodes, bipolar junction transistors, MOSFETs) and integrated devices (operational amplifiers).
Semiconductor Devices
Properties of semiconductor devices. Applications in current and future computers, fiber optic and wireless communication systems. Future needs of high frequency, GHz-range, device operation.
Semiconductor Devices for Wireless & Fiber Communication
Advanced development of semiconductor device theory focusing on optoelectronic emitters, detectors, & high frequency transistors to provide an understanding of devices used in communications systems
Integrated Circuit Fabrication
Introduction to microelectronic processing technologies and CMOS. Includes a laboratory for fabrication/testing of MOS transistors, basic CMOS circuits, integrated resistors and capacitors.
Introduction to Electronic Systems Packaging
Introduction to packaging technologies, technology drivers, electrical performance, thermal management, materials, optoelectronics, RF integration, reliability, system issues, assembly, and testing.
Integrated Circuit Fabrication
The objective of this course is to give students exposure to the various steps involved in the fabrication of integrated circuits and devices. 'The course will include a laboratory segment in which students fabricate MOS transistors, diffused resistors and MOS capacitors from a bare silicon substrate. Crosslisted with CHE 4752.
Electronics Packaging Assembly, Reliability, Thermal Management, and Test
The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems. Crosslisted with ME and MSE 4754.
Electronic Packaging Substrate Fabrication
This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. Crosslisted with CHE 4755.
Introduction to MEMS
Introduction to Micro-Electro-Mechanical systems: Microfabrication techniques including: photolithography, etching, physical and chemical vapor deposition, electroplating, bonding and polymer processing. Application to sensors and actuators. Credit not allowed for both ECE 6229 and ME 6229 or CHBE 6229.
Silicon-Based Heterostructure Devices and Circuits
Theory and design of novel silicon-germanium microelectronic devices and circuits. Materials, device physics, fabrication, measurement, circuit design, and system applications.
Introduction to Microelectronics Technology
Presents the fundamentals of microelectronics material, device, and circuit fabrication
Introduction to the Theory of Microelectronics
Basis of quantum mechanics, statistical mechanics, and the behavior of solids to serve as an introduction to the modern study of semiconductors and semiconductor devices.
Theory of Electronic Devices
Presents the fundamentals of electronic device operation
Semiconductor Process Control
This course is designed to explore methods of applying statistical process control and statistical quality control to semiconductor manufacturing processes. Students will be required to complete a design project.
Solar Cells
To provide a practical understanding of semiconductor materials and technology as it relates to design and development of efficient solar cells and photovoltaic systems.
Gigascale Integration
Hierarchy of physical principles that enable understanding and estimation of future opportunities to achieve multibillion transistor silicon chips using sub-0.25 micron technology.
Microelectromechanical Devices
Fundamental concepts for design of microelectromechanical devices (MEMS), including mechanical and thermal behavior of materials and structures, transduction principles, transducer design, and modeling.
Optoelectronics: Devices, Integration, Packaging, Systems
Optoelectronic devices (detectors, emitters, modulators) from the practical realized and theoretical performance perspective. Explores monolithic and hybrid integration of devices, packaging and system implementation.
Plasma Processing of Electronic Materials and Devices
Fundamental physics, chemistry, chemical engineering and electrical engineering principles inherent in plasma processes. Includes etching, deposition, diagnostic methods, and control schemes. Cross-listed with CHE 6759.
Optoelectronics: Materials, Processes, Devices
Optoelectronic materials, physical processes, and devices. Includes compound semiconductor materials, excitation, recombination, gain, and modulation processes and devices such as emitters, detectors, and modulators. Crosslisted with PHYS 6771.
Integrated and Low-Cost Microelectronics Systems Packaging
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ME and MSE 6776.
Thermal Engineering for Packaging of Micro and Nano Systems
Passive, active, and hybrid thermal management techniques, and computational modeling of micro systems. Air cooling, simlge phase and phase change liquid cooling, heat pipes, and thermoelectrics. Crosslisted with ME 6779.